Leica CPD3 (critical point dryer)

used for preparing delicate samples by removing liquid without causing damage. It employs a critical point drying proces...

DISCO Dicer (dicing tool)

a precision cutting tool used for slicing semiconductor wafers, crystals, and other materials into smaller pieces. It en...

EVG Bonder (wafer-to-wafer bonding tool)

a tool for wafer bonding applications, including anodic, thermo-compression, and direct bonding. It is essential in the...

Westbond 4KE (wire bonder)

a versatile wire bonder used for precise electrical connections in microelectronics and semiconductor devices. It suppor...