Dry Etching
Tepla 300 (plasma etching)
The tool is used primarily for dry etching and surface cleaning of materials e.g. with O2 plasma. It is ideal for removi...
Oxford ICP Cl (reactive ion and plasma etching)
The Oxford ICP-CL is an advanced dry etching tool used for high-precision etching processes in nanotechnology. It employ...
AMS 100 I-speeder (RIE plasma etching)
Utilizing cryogenic temperatures, the AMS Cryo enables advanced etching of Si and SiN, with improved etch rates, selecti...