Oxford ICP Cl (reactive ion and plasma etching)

The Oxford ICP-CL is an advanced dry etching tool used for high-precision etching processes in nanotechnology. It employs Inductively Coupled Plasma (ICP) technology to achieve fine feature etching on various substrates. The system is renowned for its exceptional etch uniformity, high etch rates, and ability to process complex patterns with great accuracy. It is a valuable asset for both research and industrial applications, offering reliable and repeatable results in the fabrication of nanostructures.